Faulty wafers also usually have subtle defects randomly scattered on the surface, and this prevents AOI systems from setting rules for efficient inspections.

Excessive adhesive may remain on the chip or overflow on the circuit board and cause the chip to tilt, affecting stability of the whole semiconductor package.

As semiconductor manufacturing becomes more sophisticated, the process of creating lead frames needs to improve in accuracy and yield.

SolVision optimizes PCB assembly inspection with AI, enhancing accuracy, reducing errors, and boosting efficiency with our rapid learning AI vision system.

SolVision’s AI technology optimizes yarn inspection by accurately detecting various yarn defects quickly and efficiently, ensuring enhanced quality control.

SolVision enhances beer bottle inspection by detecting stains and mildew in real-time, ensuring precise defect detection on reusable glass bottles.

Powered by AI, Solomon SolVision can automate welding inspection processes by learning the different shapes and features of weld beads from sample images.

SolVision detects defective electrodes on passive electronic components to significantly improve overall production yield.