Excessive adhesive may remain on the chip or overflow on the circuit board and cause the chip to tilt, affecting stability of the whole semiconductor package.

As semiconductor manufacturing becomes more sophisticated, the process of creating lead frames needs to improve in accuracy and yield.

Automated defect detection with artificial intelligence. Visual Inspection of Semiconductor Carrier Trays.

Solomon SolVision’s Feature Detection tool first learns the position of the tray, then performs OCR with more flexibility than AOI systems.

SMT is a critical soldering process in the electronics industry. SolVision detects defects on PCBs which are known to have numerous small, complex components.

SolVision AI detects BGA soldering defects with precision, enhancing defect detection, inspection accuracy, and quality assurance for manufacturers.